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Laminated bus bars and cold plates are commonplace in a wide range of defense and space programs designed by Mersen‘s Rochester, NY plant, registered under ITAR with the U.S. State Department’s Directorate of Defense Trade Controls (DDTC).
Mersen’s laminated bus bars are engineered for optimal increased capacitance, minimal voltage drop and lower inductance ideal for SiC. All applications are tailored to a system’s environmental, physical, and electrical needs.
Mersen’s cold plates are designed to withstand harsh environment and provide a reliable cooling solution to meet application needs. The wide range of engineered solutions include air cooled heat sinks, embedded heat pipe assemblies to high performance liquid cold plates. These techniques come highly desired for removing heat from any diode, power amplifier or SiC device.
This webinar will focus on the following key topics:
• Bus Bar Solutions
• Cooling Solutions
Presenter
Philippe Roussel – VP of Global Strategic Marketing at Mersen
Philippe Roussel, Ph.D, graduated from the University of Lyon in Electronics and Microelectronics. He was granted a Ph.D in Integrated Electronics Systems from the Applied Sciences National Institute (INSA) in Lyon. He joined Mersen in 2014 as VP of Global Strategic Marketing for power electronics products line-up.
Mersen is a proud sponsor of this event.
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